LIQUID MANIFOLD STRUCTURE FOR DIRECT COOLING OF LIDDED ELECTRONICS MODULES

Embodiments of the present invention provide efficient and cost-effective systems for a lidded electronic device. The lidded electronic device includes an electronic module including an integrated circuit chip built on a substrate. The lidded electronic device also includes a module lid having a hea...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	VanDeventer Allan C, Ellsworth, JR. Michael J, Wertz Jason T
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEATING LIGHTING MECHANICAL ENGINEERING SEMICONDUCTOR DEVICES WEAPONS
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