TRANSCEIVER AND INTERFACE FOR IC PACKAGE

An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cab...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: MONGOLD John A, MUSSER Randall E, ZBINDEN Eric J, VERDIELL Jean-Marc A, VICICH Brian R, GUETIG Keith R
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator MONGOLD John A
MUSSER Randall E
ZBINDEN Eric J
VERDIELL Jean-Marc A
VICICH Brian R
GUETIG Keith R
description An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2017219788A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2017219788A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2017219788A13</originalsourceid><addsrcrecordid>eNrjZNAICXL0C3Z29QxzDVJw9HNR8PQLcQ1yc3R2VXDzD1LwdFYIcHT2dnR35WFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8aHBRgaG5kaGluYWFo6GxsSpAgB5tyTG</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>TRANSCEIVER AND INTERFACE FOR IC PACKAGE</title><source>esp@cenet</source><creator>MONGOLD John A ; MUSSER Randall E ; ZBINDEN Eric J ; VERDIELL Jean-Marc A ; VICICH Brian R ; GUETIG Keith R</creator><creatorcontrib>MONGOLD John A ; MUSSER Randall E ; ZBINDEN Eric J ; VERDIELL Jean-Marc A ; VICICH Brian R ; GUETIG Keith R</creatorcontrib><description>An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CURRENT COLLECTORS ; ELECTRIC COMMUNICATION TECHNIQUE ; ELECTRICITY ; LINE CONNECTORS ; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS ; OPTICS ; PHYSICS ; TRANSMISSION</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20170803&amp;DB=EPODOC&amp;CC=US&amp;NR=2017219788A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20170803&amp;DB=EPODOC&amp;CC=US&amp;NR=2017219788A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MONGOLD John A</creatorcontrib><creatorcontrib>MUSSER Randall E</creatorcontrib><creatorcontrib>ZBINDEN Eric J</creatorcontrib><creatorcontrib>VERDIELL Jean-Marc A</creatorcontrib><creatorcontrib>VICICH Brian R</creatorcontrib><creatorcontrib>GUETIG Keith R</creatorcontrib><title>TRANSCEIVER AND INTERFACE FOR IC PACKAGE</title><description>An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CURRENT COLLECTORS</subject><subject>ELECTRIC COMMUNICATION TECHNIQUE</subject><subject>ELECTRICITY</subject><subject>LINE CONNECTORS</subject><subject>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</subject><subject>OPTICS</subject><subject>PHYSICS</subject><subject>TRANSMISSION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAICXL0C3Z29QxzDVJw9HNR8PQLcQ1yc3R2VXDzD1LwdFYIcHT2dnR35WFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8aHBRgaG5kaGluYWFo6GxsSpAgB5tyTG</recordid><startdate>20170803</startdate><enddate>20170803</enddate><creator>MONGOLD John A</creator><creator>MUSSER Randall E</creator><creator>ZBINDEN Eric J</creator><creator>VERDIELL Jean-Marc A</creator><creator>VICICH Brian R</creator><creator>GUETIG Keith R</creator><scope>EVB</scope></search><sort><creationdate>20170803</creationdate><title>TRANSCEIVER AND INTERFACE FOR IC PACKAGE</title><author>MONGOLD John A ; MUSSER Randall E ; ZBINDEN Eric J ; VERDIELL Jean-Marc A ; VICICH Brian R ; GUETIG Keith R</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2017219788A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2017</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CURRENT COLLECTORS</topic><topic>ELECTRIC COMMUNICATION TECHNIQUE</topic><topic>ELECTRICITY</topic><topic>LINE CONNECTORS</topic><topic>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</topic><topic>OPTICS</topic><topic>PHYSICS</topic><topic>TRANSMISSION</topic><toplevel>online_resources</toplevel><creatorcontrib>MONGOLD John A</creatorcontrib><creatorcontrib>MUSSER Randall E</creatorcontrib><creatorcontrib>ZBINDEN Eric J</creatorcontrib><creatorcontrib>VERDIELL Jean-Marc A</creatorcontrib><creatorcontrib>VICICH Brian R</creatorcontrib><creatorcontrib>GUETIG Keith R</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MONGOLD John A</au><au>MUSSER Randall E</au><au>ZBINDEN Eric J</au><au>VERDIELL Jean-Marc A</au><au>VICICH Brian R</au><au>GUETIG Keith R</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>TRANSCEIVER AND INTERFACE FOR IC PACKAGE</title><date>2017-08-03</date><risdate>2017</risdate><abstract>An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US2017219788A1
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
CURRENT COLLECTORS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRICITY
LINE CONNECTORS
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
TRANSMISSION
title TRANSCEIVER AND INTERFACE FOR IC PACKAGE
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-29T18%3A03%3A34IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=MONGOLD%20John%20A&rft.date=2017-08-03&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2017219788A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true