HIGH DENSITY INTEGRATED CIRCUIT PACKAGE STRUCTURE AND INTEGRATED CIRCUIT

HIGH DENSITY INTEGRATED CIRCUIT PACKAGE STRUCTURE AND INTEGRATED CIRCUIT

The present invention relates to the technical field of integrated circuit package, and more specifically, this invention relates to a high density integrated circuit package structure and an integrated circuit with this package structure. A high density integrated circuit package structure accordin...

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1. Verfasser: LIANG Dazhong
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator LIANG Dazhong
description The present invention relates to the technical field of integrated circuit package, and more specifically, this invention relates to a high density integrated circuit package structure and an integrated circuit with this package structure. A high density integrated circuit package structure according to this invention comprises a sealed metal lead frame, a chip, and a cuboid plastic package structure with micron connecting wires. The length (A1) of the plastic package structure meets the relationship 1.20 mm+(B−8)×0.3 mm/2≦A1≦4.50 mm+(B−8)×1.00 mm/2, the width (A2) of the plastic package structure meets the relationship 1.20 mm≦A2≦3.50 mm, the thickness (A3) of the plastic package structure meets the relationship A3≧0.35 mm, and B is the number of the outer leads and is an integer number meeting the relationship 4≦B≦68. A package structure according to this invention may meet the demands generated when chip manufacturing technology progresses from micron scale to sub-micron scale, or even nanometer scale. It may satisfy the requirements of low power consumption, high speed, large capacity and small volume for portable products.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title HIGH DENSITY INTEGRATED CIRCUIT PACKAGE STRUCTURE AND INTEGRATED CIRCUIT
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