Semiconductor Devices with a Thermally Conductive Layer and Methods of Their Fabrication

An embodiment of a semiconductor device includes a semiconductor substrate that includes a host substrate and an upper surface, an active area, a substrate opening in the semiconductor substrate that is partially defined by a recessed surface, and a thermally conductive layer disposed over the semic...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Viswanathan Lakshminarayan, Green Bruce M, Hill Darrell G, Mahalingam L. M
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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