LOW COST HERMETIC MICRO-ELECTRONICS

A hermetically sealed electronic device and method of fabrication are provided. A base layer of a wafer is created using a substrate formed from ultra-thin glass or ceramic using panel or roll to roll processing. One or more layers are bonded to the base layer. The wafer is singulated into a plurali...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LU Minhua, POLASTRE Robert John, NAH Jae-Woong, KNICKERBOCKER John U, DANG Bing
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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