Packages with Molding Structures and Methods of Forming the Same

A method includes molding a device die in a molding material, wherein a metal pillar of the device die is exposed through a surface of the molding material. A substrate is adhered to the molding material. The substrate includes a redistribution layer that further includes redistribution lines. A pla...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Liu Chung-Shi, Wu Cheng-Tar, Cheng Ming-Da, Huang Chih-Fan, Yu Chen-Hua
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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