DECOUPLING CAPACITORS AND ARRANGEMENTS

Various embodiments of transistor assemblies, integrated circuit devices, and related methods are disclosed herein. In some embodiments, a transistor assembly may include a base layer in which a transistor is disposed, a first metal layer, and a second metal layer disposed between the base layer and...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: GOEL Niti, BOU-GHAZALE Silvio E, ELSAYED Rany T
Format: Patent
Sprache:eng
Schlagworte:
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