MICROELECTRONIC PACKAGE AND METHOD OF MANUFACTURING A MICROELECTRONIC PACKAGE

The present invention concerns a microelectronic package (1) comprising a microelectronic structure (2) having at least a first opening (3) and defining a first cavity (4), a capping layer (9) having at least a second opening (10) and defining a second cavity (11) which is connected to the first cav...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	DEN DEKKER Arnoldus, GIESEN Marcel, PORNIN Jean-Louis, REIG Bruno, SAINT-PATRICE Damien, HENN Gudrun
Format:	Patent
Sprache:	eng
Schlagworte:	MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS TRANSPORTING
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