METHOD FOR SOLDERING SHAPE MEMORY ALLOYS
A method of soldering a shape memory alloy (SMA) element to a component includes positioning a tinned end of the SMA element with respect to a surface of the component, and then directly soldering the tinned end to the surface using solder material having a low liquidus temperature of 500° F. or les...
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| creator | Balogh Michael P Pinto, IV Nicholas W Johnson Nancy L Irish Nicholas P Haddad Daad B |
| description | A method of soldering a shape memory alloy (SMA) element to a component includes positioning a tinned end of the SMA element with respect to a surface of the component, and then directly soldering the tinned end to the surface using solder material having a low liquidus temperature of 500° F. or less when an oxide layer is not present on the SMA element. The end may be soldered using lead-based solder material at a higher temperature when an oxide layer is present. The end may be tinned with flux material containing phosphoric acid or tin fluoride prior to soldering the SMA element. The SMA element may be submersed in an acid bath to remove the oxide layer. The solder material may contain tin and silver, antimony, or zinc, or other materials sufficient for achieving the low liquidus temperature. Heat penetrating the SMA element is controlled to protect shape memory abilities. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2017127532A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2017127532A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2017127532A13</originalsourceid><addsrcrecordid>eNrjZNDwdQ3x8HdRcPMPUgj293FxDfL0c1cI9nAMcFXwdfX1D4pUcPTx8Y8M5mFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8aHBRgaG5oZG5qbGRo6GxsSpAgCaxyUM</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHOD FOR SOLDERING SHAPE MEMORY ALLOYS</title><source>esp@cenet</source><creator>Balogh Michael P ; Pinto, IV Nicholas W ; Johnson Nancy L ; Irish Nicholas P ; Haddad Daad B</creator><creatorcontrib>Balogh Michael P ; Pinto, IV Nicholas W ; Johnson Nancy L ; Irish Nicholas P ; Haddad Daad B</creatorcontrib><description>A method of soldering a shape memory alloy (SMA) element to a component includes positioning a tinned end of the SMA element with respect to a surface of the component, and then directly soldering the tinned end to the surface using solder material having a low liquidus temperature of 500° F. or less when an oxide layer is not present on the SMA element. The end may be soldered using lead-based solder material at a higher temperature when an oxide layer is present. The end may be tinned with flux material containing phosphoric acid or tin fluoride prior to soldering the SMA element. The SMA element may be submersed in an acid bath to remove the oxide layer. The solder material may contain tin and silver, antimony, or zinc, or other materials sufficient for achieving the low liquidus temperature. Heat penetrating the SMA element is controlled to protect shape memory abilities.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACHINE TOOLS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170504&DB=EPODOC&CC=US&NR=2017127532A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170504&DB=EPODOC&CC=US&NR=2017127532A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Balogh Michael P</creatorcontrib><creatorcontrib>Pinto, IV Nicholas W</creatorcontrib><creatorcontrib>Johnson Nancy L</creatorcontrib><creatorcontrib>Irish Nicholas P</creatorcontrib><creatorcontrib>Haddad Daad B</creatorcontrib><title>METHOD FOR SOLDERING SHAPE MEMORY ALLOYS</title><description>A method of soldering a shape memory alloy (SMA) element to a component includes positioning a tinned end of the SMA element with respect to a surface of the component, and then directly soldering the tinned end to the surface using solder material having a low liquidus temperature of 500° F. or less when an oxide layer is not present on the SMA element. The end may be soldered using lead-based solder material at a higher temperature when an oxide layer is present. The end may be tinned with flux material containing phosphoric acid or tin fluoride prior to soldering the SMA element. The SMA element may be submersed in an acid bath to remove the oxide layer. The solder material may contain tin and silver, antimony, or zinc, or other materials sufficient for achieving the low liquidus temperature. Heat penetrating the SMA element is controlled to protect shape memory abilities.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACHINE TOOLS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNDwdQ3x8HdRcPMPUgj293FxDfL0c1cI9nAMcFXwdfX1D4pUcPTx8Y8M5mFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8aHBRgaG5oZG5qbGRo6GxsSpAgCaxyUM</recordid><startdate>20170504</startdate><enddate>20170504</enddate><creator>Balogh Michael P</creator><creator>Pinto, IV Nicholas W</creator><creator>Johnson Nancy L</creator><creator>Irish Nicholas P</creator><creator>Haddad Daad B</creator><scope>EVB</scope></search><sort><creationdate>20170504</creationdate><title>METHOD FOR SOLDERING SHAPE MEMORY ALLOYS</title><author>Balogh Michael P ; Pinto, IV Nicholas W ; Johnson Nancy L ; Irish Nicholas P ; Haddad Daad B</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2017127532A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2017</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MACHINE TOOLS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>Balogh Michael P</creatorcontrib><creatorcontrib>Pinto, IV Nicholas W</creatorcontrib><creatorcontrib>Johnson Nancy L</creatorcontrib><creatorcontrib>Irish Nicholas P</creatorcontrib><creatorcontrib>Haddad Daad B</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Balogh Michael P</au><au>Pinto, IV Nicholas W</au><au>Johnson Nancy L</au><au>Irish Nicholas P</au><au>Haddad Daad B</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD FOR SOLDERING SHAPE MEMORY ALLOYS</title><date>2017-05-04</date><risdate>2017</risdate><abstract>A method of soldering a shape memory alloy (SMA) element to a component includes positioning a tinned end of the SMA element with respect to a surface of the component, and then directly soldering the tinned end to the surface using solder material having a low liquidus temperature of 500° F. or less when an oxide layer is not present on the SMA element. The end may be soldered using lead-based solder material at a higher temperature when an oxide layer is present. The end may be tinned with flux material containing phosphoric acid or tin fluoride prior to soldering the SMA element. The SMA element may be submersed in an acid bath to remove the oxide layer. The solder material may contain tin and silver, antimony, or zinc, or other materials sufficient for achieving the low liquidus temperature. Heat penetrating the SMA element is controlled to protect shape memory abilities.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | METHOD FOR SOLDERING SHAPE MEMORY ALLOYS |
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