ALIGNMENT FIXTURES FOR INTEGRATED CIRCUIT PACKAGES

Embodiments of alignment fixtures for integrated circuit (IC) packages, and related techniques, are disclosed herein. In some embodiments, an alignment fixture for an IC package may include: a first socket having a recess dimensioned to receive a first surface of the IC package and having a first ma...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ABAZARNIA Nader N, CHIGULLAPALLI Sruti, SANCHEZ Rene J, COONS Todd R, GOH Tuan Hoong
Format:	Patent
Sprache:	eng
Schlagworte:	MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS TESTING
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