SEMICONDUCTOR CHIP WITH PATTERNED UNDERBUMP METALLIZATION AND POLYMER FILM

Various semiconductor chip solder bump and underbump metallization (UBM) structures and methods of making the same are disclosed. In one aspect, a method is provided that includes forming a first underbump metallization layer on a semiconductor chip is provided. The first underbump metallization lay...

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Bibliographische Detailangaben

Hauptverfasser:	Hu Suming, Low Yip Seng, Topacio Roden R
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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