SUBSTRATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND METHOD FOR PRODUCING SUBSTRATE FOR PRINTED CIRCUIT BOARD

SUBSTRATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND METHOD FOR PRODUCING SUBSTRATE FOR PRINTED CIRCUIT BOARD

A substrate for a printed circuit board according to the present invention includes a base film having an insulating property and including at least one opening; a first conductive layer that is formed on both surfaces of the base film by applying and heat-treating a conductive ink containing metal...

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Hauptverfasser: PARK Jinjoo, UEHARA Sumito, MIURA Kousuke, UEDA Hiroshi, OKA Yoshio, KASUGA Takashi
Format: Patent
Sprache:eng
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator PARK Jinjoo
UEHARA Sumito
MIURA Kousuke
UEDA Hiroshi
OKA Yoshio
KASUGA Takashi
description A substrate for a printed circuit board according to the present invention includes a base film having an insulating property and including at least one opening; a first conductive layer that is formed on both surfaces of the base film by applying and heat-treating a conductive ink containing metal particles, and that fills the at least one opening; and a second conductive layer formed, by plating, on at least one of surfaces of the first conductive layer. The metal particles preferably have a mean particle size of 1 nm or more and 500 nm or less.
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title SUBSTRATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND METHOD FOR PRODUCING SUBSTRATE FOR PRINTED CIRCUIT BOARD
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