ENCAPSULATED SEMICONDUCTOR DEVICE PACKAGE WITH HEATSINK OPENING, AND METHODS OF MANUFACTURE THEREOF

Embodiments include packaged semiconductor devices and methods of manufacturing packaged semiconductor devices. A semiconductor die includes a conductive feature coupled to a bottom surface of the die. The conductive feature only partially covers the bottom die surface to define a conductor-less reg...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ABDO DAVID F, JONES JEFFREY K
Format:	Patent
Sprache:	eng
Schlagworte:	AMPLIFIERS BASIC ELECTRIC ELEMENTS BASIC ELECTRONIC CIRCUITRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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