ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF

An electronic device package and manufacturing method are provided, including steps of: providing a carrier having at least an electronic element and at least a package block disposed thereon, wherein the package block has a plurality of conductive posts bonded to the carrier; forming an encapsulant...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Lee Meng-Tsung, Huang Fu-Tang
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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