SPLIT BALL GRID ARRAY PAD FOR MULTI-CHIP MODULES

A multi-chip module and method of fabricating a multi-chip module. The multi-chip module includes: a substrate having a top surface and a bottom surface and containing multiple wiring layers, first pads on the top surface of the substrate and second pads on the bottom surface of the substrate; a fir...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Sauter Wolfgang, Minier Dany, Stone David B, Call Anson J, Cohen Erwin B, Tremble Eric W
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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