SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

According to one embodiment, a manufacturing method of a semiconductor device comprises forming a first pattern and a second pattern to be placed apart on a semiconductor substrate; and forming an arch pattern in which the tops of the first pattern and of the second pattern touch by making the first...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: OHASHI Takashi, OHTSUKI Takuya
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:According to one embodiment, a manufacturing method of a semiconductor device comprises forming a first pattern and a second pattern to be placed apart on a semiconductor substrate; and forming an arch pattern in which the tops of the first pattern and of the second pattern touch by making the first pattern and the second pattern bend in directions in which they face each other.