COMPOSITION FOR BLACKENING COPPER-BASED OR SILVER-BASED METALS
The present invention addresses the problem of providing a new composition for blackening that, without compromising the smoothness of copper-based or silver-based metals, allows for sufficient blackening of copper circuits of printed wiring boards, circuits formed by silver paste, and products cont...
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| creator | Sakai Hiroaki Kita Azusa Kang Joonhaeng |
| description | The present invention addresses the problem of providing a new composition for blackening that, without compromising the smoothness of copper-based or silver-based metals, allows for sufficient blackening of copper circuits of printed wiring boards, circuits formed by silver paste, and products containing copper-based or silver-based metals, such as other various kinds of copper, copper alloys, silver, and silver alloys. The present invention provides a composition for blackening copper-based or silver-based metals, said composition comprising an aqueous solution containing (i) at least one water-soluble metal compound selected from the group consisting of water-soluble palladium compounds, water-soluble ruthenium compounds, and water-soluble silver compounds; (ii) at least one halide selected from the group consisting of hydrohalic acids, metal halides, and ammonium halides; and (iii) at least one nitrogen atom-containing compound selected from the group consisting of alkylene diamines, polyalkylene polyamines, polyamide polyamines, and cross-linked polyamide polyamines. |
| format | Patent |
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The present invention provides a composition for blackening copper-based or silver-based metals, said composition comprising an aqueous solution containing (i) at least one water-soluble metal compound selected from the group consisting of water-soluble palladium compounds, water-soluble ruthenium compounds, and water-soluble silver compounds; (ii) at least one halide selected from the group consisting of hydrohalic acids, metal halides, and ammonium halides; and (iii) at least one nitrogen atom-containing compound selected from the group consisting of alkylene diamines, polyalkylene polyamines, polyamide polyamines, and cross-linked polyamide polyamines.</description><language>eng</language><subject>CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170316&DB=EPODOC&CC=US&NR=2017073818A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170316&DB=EPODOC&CC=US&NR=2017073818A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Sakai Hiroaki</creatorcontrib><creatorcontrib>Kita Azusa</creatorcontrib><creatorcontrib>Kang Joonhaeng</creatorcontrib><title>COMPOSITION FOR BLACKENING COPPER-BASED OR SILVER-BASED METALS</title><description>The present invention addresses the problem of providing a new composition for blackening that, without compromising the smoothness of copper-based or silver-based metals, allows for sufficient blackening of copper circuits of printed wiring boards, circuits formed by silver paste, and products containing copper-based or silver-based metals, such as other various kinds of copper, copper alloys, silver, and silver alloys. The present invention provides a composition for blackening copper-based or silver-based metals, said composition comprising an aqueous solution containing (i) at least one water-soluble metal compound selected from the group consisting of water-soluble palladium compounds, water-soluble ruthenium compounds, and water-soluble silver compounds; (ii) at least one halide selected from the group consisting of hydrohalic acids, metal halides, and ammonium halides; and (iii) at least one nitrogen atom-containing compound selected from the group consisting of alkylene diamines, polyalkylene polyamines, polyamide polyamines, and cross-linked polyamide polyamines.</description><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLBz9vcN8A_2DPH091Nw8w9ScPJxdPZ29fP0c1dw9g8IcA3SdXIMdnVRAEoFe_qEwfm-riGOPsE8DKxpiTnFqbxQmptB2c01xNlDN7UgPz61uCAxOTUvtSQ-NNjIwNDcwNzYwtDC0dCYOFUAARorCQ</recordid><startdate>20170316</startdate><enddate>20170316</enddate><creator>Sakai Hiroaki</creator><creator>Kita Azusa</creator><creator>Kang Joonhaeng</creator><scope>EVB</scope></search><sort><creationdate>20170316</creationdate><title>COMPOSITION FOR BLACKENING COPPER-BASED OR SILVER-BASED METALS</title><author>Sakai Hiroaki ; Kita Azusa ; Kang Joonhaeng</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2017073818A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2017</creationdate><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>Sakai Hiroaki</creatorcontrib><creatorcontrib>Kita Azusa</creatorcontrib><creatorcontrib>Kang Joonhaeng</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Sakai Hiroaki</au><au>Kita Azusa</au><au>Kang Joonhaeng</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>COMPOSITION FOR BLACKENING COPPER-BASED OR SILVER-BASED METALS</title><date>2017-03-16</date><risdate>2017</risdate><abstract>The present invention addresses the problem of providing a new composition for blackening that, without compromising the smoothness of copper-based or silver-based metals, allows for sufficient blackening of copper circuits of printed wiring boards, circuits formed by silver paste, and products containing copper-based or silver-based metals, such as other various kinds of copper, copper alloys, silver, and silver alloys. The present invention provides a composition for blackening copper-based or silver-based metals, said composition comprising an aqueous solution containing (i) at least one water-soluble metal compound selected from the group consisting of water-soluble palladium compounds, water-soluble ruthenium compounds, and water-soluble silver compounds; (ii) at least one halide selected from the group consisting of hydrohalic acids, metal halides, and ammonium halides; and (iii) at least one nitrogen atom-containing compound selected from the group consisting of alkylene diamines, polyalkylene polyamines, polyamide polyamines, and cross-linked polyamide polyamines.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | COMPOSITION FOR BLACKENING COPPER-BASED OR SILVER-BASED METALS |
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