SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME

According to one embodiment a semiconductor memory device includes a first stacked body, a pillar, a memory film, a capacitive element, a first wiring, and a second wiring. The capacitive element includes a first conductive member and a second conductive member. A first length of the first conductiv...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	TAKAMATSU Tomohiro
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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