ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF

A method for fabricating an electronic package is provided, including the steps of: providing an interposer having a plurality of conductive vias and at least an opening formed at a periphery of the conductive vias; disposing at least an electronic element on the interposer; and bonding a cover plat...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Lai Yi-Che, Chang Hung-Hsien, Liang Fang-Yu
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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