SUBSTRATE ON SUBSTRATE PACKAGE

Embodiments herein may relate to a patch on interposer (PoINT) architecture. In embodiments, the PoINT architecture may include a plurality of solder joints between a patch and an interposer. The solder joints may include a relatively high temperature solder ball and a relatively low temperature sol...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Renavikar Mukul P, Mirpuri Kabirkumar J, Lu Jiongxin, Canham Beverly J, Krajniak Jan, Deppisch Carl L, Wei Yuying, Hua Fay, Jiang Hongjin
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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