SEMICONDUCTOR DEVICE AND METHOD

Disclosed herein is a semiconductor device that includes a semiconductor die and a substrate including a first surface and a second surface. The substrate includes a conductive circuit and an insulative material over the conductive circuit. The semiconductor die is attached to the second surface. Th...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: Rusli Sukianto
Format: Patent
Sprache:eng
Schlagworte:
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