SERVER WITH HEAT PIPE COOLING
A server includes a tray that has a front portion and a back portion. A motherboard is disposed in the front portion of the tray and the motherboard is coupled to a heat sink. A fan is disposed in the back portion of the tray. A hard drive is disposed between the motherboard and the fan and the hard...
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| creator | Schlichter Kevin Kinstle Robert Michael Barron Seitu |
| description | A server includes a tray that has a front portion and a back portion. A motherboard is disposed in the front portion of the tray and the motherboard is coupled to a heat sink. A fan is disposed in the back portion of the tray. A hard drive is disposed between the motherboard and the fan and the hard drive is operatively connected to the motherboard. The server also includes a heat pipe that has a body longitudinally bounded by an inlet and an outlet. The inlet is coupled to the heat sink, while the outlet is coupled to the fan. The body of the heat pipe extends past the hard drive. A power supply is also disposed in the tray and is operatively connected to the motherboard, the fan, and the hard drive. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2017017278A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2017017278A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2017017278A13</originalsourceid><addsrcrecordid>eNrjZJANdg0Kcw1SCPcM8VDwcHUMUQjwDHBVcPb39_H0c-dhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGhuZAZGRu4WhoTJwqAAzKIew</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SERVER WITH HEAT PIPE COOLING</title><source>esp@cenet</source><creator>Schlichter Kevin ; Kinstle Robert Michael ; Barron Seitu</creator><creatorcontrib>Schlichter Kevin ; Kinstle Robert Michael ; Barron Seitu</creatorcontrib><description>A server includes a tray that has a front portion and a back portion. A motherboard is disposed in the front portion of the tray and the motherboard is coupled to a heat sink. A fan is disposed in the back portion of the tray. A hard drive is disposed between the motherboard and the fan and the hard drive is operatively connected to the motherboard. The server also includes a heat pipe that has a body longitudinally bounded by an inlet and an outlet. The inlet is coupled to the heat sink, while the outlet is coupled to the fan. The body of the heat pipe extends past the hard drive. A power supply is also disposed in the tray and is operatively connected to the motherboard, the fan, and the hard drive.</description><language>eng</language><subject>CALCULATING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; COMPUTING ; COUNTING ; ELECTRIC DIGITAL DATA PROCESSING ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PHYSICS ; PRINTED CIRCUITS</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170119&DB=EPODOC&CC=US&NR=2017017278A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170119&DB=EPODOC&CC=US&NR=2017017278A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Schlichter Kevin</creatorcontrib><creatorcontrib>Kinstle Robert Michael</creatorcontrib><creatorcontrib>Barron Seitu</creatorcontrib><title>SERVER WITH HEAT PIPE COOLING</title><description>A server includes a tray that has a front portion and a back portion. A motherboard is disposed in the front portion of the tray and the motherboard is coupled to a heat sink. A fan is disposed in the back portion of the tray. A hard drive is disposed between the motherboard and the fan and the hard drive is operatively connected to the motherboard. The server also includes a heat pipe that has a body longitudinally bounded by an inlet and an outlet. The inlet is coupled to the heat sink, while the outlet is coupled to the fan. The body of the heat pipe extends past the hard drive. A power supply is also disposed in the tray and is operatively connected to the motherboard, the fan, and the hard drive.</description><subject>CALCULATING</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>ELECTRIC DIGITAL DATA PROCESSING</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJANdg0Kcw1SCPcM8VDwcHUMUQjwDHBVcPb39_H0c-dhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGhuZAZGRu4WhoTJwqAAzKIew</recordid><startdate>20170119</startdate><enddate>20170119</enddate><creator>Schlichter Kevin</creator><creator>Kinstle Robert Michael</creator><creator>Barron Seitu</creator><scope>EVB</scope></search><sort><creationdate>20170119</creationdate><title>SERVER WITH HEAT PIPE COOLING</title><author>Schlichter Kevin ; Kinstle Robert Michael ; Barron Seitu</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2017017278A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2017</creationdate><topic>CALCULATING</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>ELECTRIC DIGITAL DATA PROCESSING</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>Schlichter Kevin</creatorcontrib><creatorcontrib>Kinstle Robert Michael</creatorcontrib><creatorcontrib>Barron Seitu</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Schlichter Kevin</au><au>Kinstle Robert Michael</au><au>Barron Seitu</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SERVER WITH HEAT PIPE COOLING</title><date>2017-01-19</date><risdate>2017</risdate><abstract>A server includes a tray that has a front portion and a back portion. A motherboard is disposed in the front portion of the tray and the motherboard is coupled to a heat sink. A fan is disposed in the back portion of the tray. A hard drive is disposed between the motherboard and the fan and the hard drive is operatively connected to the motherboard. The server also includes a heat pipe that has a body longitudinally bounded by an inlet and an outlet. The inlet is coupled to the heat sink, while the outlet is coupled to the fan. The body of the heat pipe extends past the hard drive. A power supply is also disposed in the tray and is operatively connected to the motherboard, the fan, and the hard drive.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS |
| title | SERVER WITH HEAT PIPE COOLING |
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