METHOD OF MAKING POLISHING LAYER FOR CHEMICAL MECHANICAL POLISHING PAD

A method of forming a chemical mechanical polishing pad polishing layer is provided, including: providing a mold having a base with a negative of a groove pattern; providing a poly side (P) liquid component; providing an iso side (I) liquid component; providing a pressurized gas; providing an axial...

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Bibliographische Detailangaben
Hauptverfasser: Miller Jeffrey B, Brugarolas Brufau Teresa, Yeh Fengji, Wank Andrew, Tong Yuhua, Lugo Diego, Veneziale David Michael, Kozhukh Julia, Qian Bainian, DeGroot Marty W, Jacob George C
Format: Patent
Sprache:eng
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