METHOD OF MAKING POLISHING LAYER FOR CHEMICAL MECHANICAL POLISHING PAD
A method of forming a chemical mechanical polishing pad polishing layer is provided, including: providing a mold having a base with a negative of a groove pattern; providing a poly side (P) liquid component; providing an iso side (I) liquid component; providing a pressurized gas; providing an axial...
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| creator | Miller Jeffrey B Brugarolas Brufau Teresa Yeh Fengji Wank Andrew Tong Yuhua Lugo Diego Veneziale David Michael Kozhukh Julia Qian Bainian DeGroot Marty W Jacob George C |
| description | A method of forming a chemical mechanical polishing pad polishing layer is provided, including: providing a mold having a base with a negative of a groove pattern; providing a poly side (P) liquid component; providing an iso side (I) liquid component; providing a pressurized gas; providing an axial mixing device; introducing the poly side (P) liquid component, the iso side (I) liquid component and the pressurized gas to the axial mixing device to form a combination; discharging the combination from the axial mixing device at a velocity of 10 to 300 m/sec toward the base; allowing the combination to solidify into a cake; deriving the chemical mechanical polishing pad polishing layer from the cake; wherein the chemical mechanical polishing pad polishing layer has a polishing surface with the groove pattern formed into the polishing surface; and wherein the polishing surface is adapted for polishing a substrate. |
| format | Patent |
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Yeh Fengji ; Wank Andrew ; Tong Yuhua ; Lugo Diego ; Veneziale David Michael ; Kozhukh Julia ; Qian Bainian ; DeGroot Marty W ; Jacob George C</creatorcontrib><description>A method of forming a chemical mechanical polishing pad polishing layer is provided, including: providing a mold having a base with a negative of a groove pattern; providing a poly side (P) liquid component; providing an iso side (I) liquid component; providing a pressurized gas; providing an axial mixing device; introducing the poly side (P) liquid component, the iso side (I) liquid component and the pressurized gas to the axial mixing device to form a combination; discharging the combination from the axial mixing device at a velocity of 10 to 300 m/sec toward the base; allowing the combination to solidify into a cake; deriving the chemical mechanical polishing pad polishing layer from the cake; wherein the chemical mechanical polishing pad polishing layer has a polishing surface with the groove pattern formed into the polishing surface; and wherein the polishing surface is adapted for polishing a substrate.</description><language>eng</language><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; TOOLS FOR GRINDING, BUFFING, OR SHARPENING ; TRANSPORTING</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20161229&DB=EPODOC&CC=US&NR=2016375553A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20161229&DB=EPODOC&CC=US&NR=2016375553A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Miller Jeffrey B</creatorcontrib><creatorcontrib>Brugarolas Brufau Teresa</creatorcontrib><creatorcontrib>Yeh Fengji</creatorcontrib><creatorcontrib>Wank Andrew</creatorcontrib><creatorcontrib>Tong Yuhua</creatorcontrib><creatorcontrib>Lugo Diego</creatorcontrib><creatorcontrib>Veneziale David Michael</creatorcontrib><creatorcontrib>Kozhukh Julia</creatorcontrib><creatorcontrib>Qian Bainian</creatorcontrib><creatorcontrib>DeGroot Marty W</creatorcontrib><creatorcontrib>Jacob George C</creatorcontrib><title>METHOD OF MAKING POLISHING LAYER FOR CHEMICAL MECHANICAL POLISHING PAD</title><description>A method of forming a chemical mechanical polishing pad polishing layer is provided, including: providing a mold having a base with a negative of a groove pattern; providing a poly side (P) liquid component; providing an iso side (I) liquid component; providing a pressurized gas; providing an axial mixing device; introducing the poly side (P) liquid component, the iso side (I) liquid component and the pressurized gas to the axial mixing device to form a combination; discharging the combination from the axial mixing device at a velocity of 10 to 300 m/sec toward the base; allowing the combination to solidify into a cake; deriving the chemical mechanical polishing pad polishing layer from the cake; wherein the chemical mechanical polishing pad polishing layer has a polishing surface with the groove pattern formed into the polishing surface; and wherein the polishing surface is adapted for polishing a substrate.</description><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>TOOLS FOR GRINDING, BUFFING, OR SHARPENING</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHDzdQ3x8HdR8HdT8HX09vRzVwjw9_EM9gCxfBwjXYMU3PyDFJw9XH09nR19FHxdnT0c_cBMhLoARxceBta0xJziVF4ozc2g7OYa4uyhm1qQH59aXJCYnJqXWhIfGmxkYGhmbG5qamrsaGhMnCoAMV4s5g</recordid><startdate>20161229</startdate><enddate>20161229</enddate><creator>Miller Jeffrey B</creator><creator>Brugarolas Brufau Teresa</creator><creator>Yeh Fengji</creator><creator>Wank Andrew</creator><creator>Tong Yuhua</creator><creator>Lugo Diego</creator><creator>Veneziale David Michael</creator><creator>Kozhukh Julia</creator><creator>Qian Bainian</creator><creator>DeGroot Marty W</creator><creator>Jacob George C</creator><scope>EVB</scope></search><sort><creationdate>20161229</creationdate><title>METHOD OF MAKING POLISHING LAYER FOR CHEMICAL MECHANICAL POLISHING PAD</title><author>Miller Jeffrey B ; Brugarolas Brufau Teresa ; Yeh Fengji ; Wank Andrew ; Tong Yuhua ; Lugo Diego ; Veneziale David Michael ; Kozhukh Julia ; Qian Bainian ; DeGroot Marty W ; Jacob George C</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2016375553A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2016</creationdate><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>TOOLS FOR GRINDING, BUFFING, OR SHARPENING</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>Miller Jeffrey B</creatorcontrib><creatorcontrib>Brugarolas Brufau Teresa</creatorcontrib><creatorcontrib>Yeh Fengji</creatorcontrib><creatorcontrib>Wank Andrew</creatorcontrib><creatorcontrib>Tong Yuhua</creatorcontrib><creatorcontrib>Lugo Diego</creatorcontrib><creatorcontrib>Veneziale David Michael</creatorcontrib><creatorcontrib>Kozhukh Julia</creatorcontrib><creatorcontrib>Qian Bainian</creatorcontrib><creatorcontrib>DeGroot Marty W</creatorcontrib><creatorcontrib>Jacob George C</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Miller Jeffrey B</au><au>Brugarolas Brufau Teresa</au><au>Yeh Fengji</au><au>Wank Andrew</au><au>Tong Yuhua</au><au>Lugo Diego</au><au>Veneziale David Michael</au><au>Kozhukh Julia</au><au>Qian Bainian</au><au>DeGroot Marty W</au><au>Jacob George C</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD OF MAKING POLISHING LAYER FOR CHEMICAL MECHANICAL POLISHING PAD</title><date>2016-12-29</date><risdate>2016</risdate><abstract>A method of forming a chemical mechanical polishing pad polishing layer is provided, including: providing a mold having a base with a negative of a groove pattern; providing a poly side (P) liquid component; providing an iso side (I) liquid component; providing a pressurized gas; providing an axial mixing device; introducing the poly side (P) liquid component, the iso side (I) liquid component and the pressurized gas to the axial mixing device to form a combination; discharging the combination from the axial mixing device at a velocity of 10 to 300 m/sec toward the base; allowing the combination to solidify into a cake; deriving the chemical mechanical polishing pad polishing layer from the cake; wherein the chemical mechanical polishing pad polishing layer has a polishing surface with the groove pattern formed into the polishing surface; and wherein the polishing surface is adapted for polishing a substrate.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING |
| title | METHOD OF MAKING POLISHING LAYER FOR CHEMICAL MECHANICAL POLISHING PAD |
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