DEVICE STRUCTURES FOR A SILICON-ON-INSULATOR SUBSTRATE WITH A HIGH-RESISTANCE HANDLE WAFER

Methods for forming a device structure and device structures using a silicon-on-insulator substrate that includes a high-resistance handle wafer. A doped region is formed in the high-resistance handle wafer. A first trench is formed that extends through a device layer and a buried insulator layer of...

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Bibliographische Detailangaben
Hauptverfasser: Stamper Anthony K, Ding Hanyi, Feilchenfeld Natalie B, Camillo-Castillo Renata, Jain Vibhor
Format: Patent
Sprache:eng
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