WAFER LEVEL PACKAGE

WAFER LEVEL PACKAGE

A water level package includes a substrate, a plurality of semiconductor chips mounted on the substrate, and molding members that contact the substrate and the plurality of semiconductor chips and are formed on the substrate. The molding members include two or more molding members that have coeffici...

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Hauptverfasser: CHO Kyong-soon, RYU Han-Sung
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator CHO Kyong-soon
RYU Han-Sung
description A water level package includes a substrate, a plurality of semiconductor chips mounted on the substrate, and molding members that contact the substrate and the plurality of semiconductor chips and are formed on the substrate. The molding members include two or more molding members that have coefficients of thermal expansion (CTEs) different from each other.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title WAFER LEVEL PACKAGE
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