METHOD OF PRODUCING A SEMICONDUCTOR DEVICE WITH PROTRUDING CONTACTS

A wiring (3) comprising electrical conductors (4, 5, 6, 7) is formed in a dielectric layer (2) on or above a semiconductor substrate (1), an opening is formed in the dielectric layer to uncover a contact pad (8), which is formed by one of the conductors, and a further opening is formed in the dielec...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Rohracher Karl, Kraft Jochen, Schrems Martin
Format: Patent
Sprache:eng
Schlagworte:
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