SEMICONDUCTOR LEAD FRAME, SEMICONDUCTOR PACKAGE, AND MANUFACTURING METHOD THEREOF

A semiconductor lead frame includes a metal plate and a semiconductor chip mounting area provided on a top surface of the metal plate. A first plating layer for an internal terminal is provided around the semiconductor chip mounting area. A second plating layer for an external terminal is provided o...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Hishiki Kaoru, Iidani Ichinori
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!