SEMICONDUCTOR DEVICE PACKAGES INCLUDING A CONTROLLER ELEMENT AND RELATED METHODS

Semiconductor device packages include a stack of semiconductor memory devices positioned over an interposer substrate, a controller element, and a redistribution substrate positioned laterally adjacent to the controller element. At least a portion of the controller element is positioned directly bet...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Ye Seng Kim Dalson, Ng Hong Wan
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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