LOW-STRESS LOW-HYDROGEN LPCVD SILICON NITRIDE

A microelectronic device contains a high performance silicon nitride layer which is stoichiometric within 2 atomic percent, has a low stress of 600 MPa to 1000 MPa, and has a low hydrogen content, less than 5 atomic percent, formed by an LPCVD process. The LPCVD process uses ammonia and dichlorosila...

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Bibliographische Detailangaben
1. Verfasser: Dellas Nicholas Stephen
Format: Patent
Sprache:eng
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