LIGHT EMITTING DEVICE PACKAGE

LIGHT EMITTING DEVICE PACKAGE

A packaged light emitting device die includes a package body having a profiled leadframe embedded in a body of reflecting material. The leadframe is exposed on mounting surface only on at least one solder bonding area. Solder is present only on the at least one solder bonding area and not elsewhere....

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Hauptverfasser: Zhang Lu Fei, De Jong Boudewijn Ruben, Dijkstra Paul, Donker Marcus Franciscus, Reints Bok Aernout, Oberndorff Pascal Johannes Theodorus Lambertus
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator Zhang Lu Fei
De Jong Boudewijn Ruben
Dijkstra Paul
Donker Marcus Franciscus
Reints Bok Aernout
Oberndorff Pascal Johannes Theodorus Lambertus
description A packaged light emitting device die includes a package body having a profiled leadframe embedded in a body of reflecting material. The leadframe is exposed on mounting surface only on at least one solder bonding area. Solder is present only on the at least one solder bonding area and not elsewhere. The reflecting material provides the reflecting parts of the package so there is no need for a reflective layer to be deposited on leadframe. Moreover, the reflecting material can function as a solder resist to self-align the solder to the at least one solder bonding area.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title LIGHT EMITTING DEVICE PACKAGE
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