Hot Melt Adhesive Composition with Ethylene/a-Olefin Multi-Block Copolymer

The present disclosure is directed to a hot melt adhesive composition including: a) an ethylene/α-olefin multi-block copolymer having a weight molecular weight (Mw) less than 20,000; b) a tackifier having a softening temperature from 90° C. to 150° C.; and c) a wax.

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Hauptverfasser:	RICKEY Cynthia L, WANG Alex Y, LIPI SHAN Colin
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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creator	RICKEY Cynthia L WANG Alex Y LIPI SHAN Colin
description	The present disclosure is directed to a hot melt adhesive composition including: a) an ethylene/α-olefin multi-block copolymer having a weight molecular weight (Mw) less than 20,000; b) a tackifier having a softening temperature from 90° C. to 150° C.; and c) a wax.
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subjects	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
title	Hot Melt Adhesive Composition with Ethylene/a-Olefin Multi-Block Copolymer
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