SEMICONDUCTOR PACKAGE INCLUDING HEAT SPREADER AND METHOD FOR MANUFACTURING THE SAME

A semiconductor package includes a semiconductor chip on a package substrate, a heat spreader on the semiconductor chip, a molding layer, an adhesive film between the semiconductor chip and the heat spreader, and a through-hole passing through the heat spreader. The heat spreader includes a first su...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Kim Jae Choon, Hwang Heejung, Jang Eon Soo
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!