USING MATERIALS TO INCREASE STRUCTURAL RIGIDITY, DECREASE SIZE, IMPROVE SAFETY, ENHANCE THERMAL PERFORMANCE AND SPEED CHARGING IN SMALL FORM FACTOR DEVICES
Systems and methods may provide for a device including a housing, one or more electronic components positioned within the housing, and a first cured resin composition positioned within the housing, the first cured resin composition including a thermal energy storage material and a first filler mater...
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| creator | Stewart Michael Gallina Mark Lofland Steven Ilavarasan Ponniah Hemmeyer Mark Byrd Kevin Pidwerbecki David |
| description | Systems and methods may provide for a device including a housing, one or more electronic components positioned within the housing, and a first cured resin composition positioned within the housing, the first cured resin composition including a thermal energy storage material and a first filler material. The device may also include a second cured resin composition positioned within the housing, the second cured resin composition including the thermal energy storage material and a second filler material. The first filler material and the second filler material may be different, wherein the first cured resin composition and the second cured resin composition may encompass at least one of the one or more electronic components. In other examples, the electronic components include a power supply and the device complies with an ATEX equipment directive for explosive atmospheres. Moreover, component underfill and/or assembly overmold processes may be used to fabricate the device. |
| format | Patent |
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| language | eng |
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| subjects | CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC DIGITAL DATA PROCESSING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS TRANSMISSION |
| title | USING MATERIALS TO INCREASE STRUCTURAL RIGIDITY, DECREASE SIZE, IMPROVE SAFETY, ENHANCE THERMAL PERFORMANCE AND SPEED CHARGING IN SMALL FORM FACTOR DEVICES |
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