BOND HEAD ASSEMBLIES, THERMOCOMPRESSION BONDING SYSTEMS AND METHODS OF ASSEMBLING AND OPERATING THE SAME

BOND HEAD ASSEMBLIES, THERMOCOMPRESSION BONDING SYSTEMS AND METHODS OF ASSEMBLING AND OPERATING THE SAME

A bond head assembly for bonding a semiconductor element to a substrate is provided. The bond head assembly includes a base structure, a heater, and a clamping system securing the heater to the base structure. The clamping system includes a plurality of elastic elements constraining the heater along...

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1. Verfasser: Wasserman Matthew B
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator Wasserman Matthew B
description A bond head assembly for bonding a semiconductor element to a substrate is provided. The bond head assembly includes a base structure, a heater, and a clamping system securing the heater to the base structure. The clamping system includes a plurality of elastic elements constraining the heater along a plurality of axes.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title BOND HEAD ASSEMBLIES, THERMOCOMPRESSION BONDING SYSTEMS AND METHODS OF ASSEMBLING AND OPERATING THE SAME
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