CHANNEL LAST REPLACEMENT FLOW FOR BULK FINFETS
There is set forth herein a method including patterning a fin on a substrate of a semiconductor structure, forming dielectric material over the substrate, performing a process for removing material from a fin to define a cavity at a channel region of the fin, and forming a replacement semiconductor...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | There is set forth herein a method including patterning a fin on a substrate of a semiconductor structure, forming dielectric material over the substrate, performing a process for removing material from a fin to define a cavity at a channel region of the fin, and forming a replacement semiconductor material formation at the channel region. |
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