SEMICONDUCTOR DEVICE

Signal transmission characteristics of a semiconductor device are improved. A plurality of wirings of a wiring substrate on which a semiconductor chip is mounted include a first wiring and a second wiring that constitute a differential pair for use in transmitting a differential signal. Moreover, th...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Sakata Kazuyuki, Hiranuma Kazuhiko
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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