SEMICONDUCTOR DEVICE

Signal transmission characteristics of a semiconductor device are improved. A plurality of wirings of a wiring substrate on which a semiconductor chip is mounted include a first wiring and a second wiring that constitute a differential pair for use in transmitting a differential signal. Moreover, th...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	Sakata Kazuyuki, Hiranuma Kazuhiko
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

container_end_page
container_issue
container_start_page
container_title
container_volume
creator	Sakata Kazuyuki Hiranuma Kazuhiko
description	Signal transmission characteristics of a semiconductor device are improved. A plurality of wirings of a wiring substrate on which a semiconductor chip is mounted include a first wiring and a second wiring that constitute a differential pair for use in transmitting a differential signal. Moreover, the first wiring and the second wiring respectively have first portions that extend in parallel with each other with a first clearance and second portions that are formed on the same wiring layer as the first portions, and extend in parallel with each other with a second clearance and third portions that are installed between the first portions and the second portions and designed to detour in such directions as to allow the mutual clearance to become greater than the first clearance and the second clearance.
format	Patent
fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2016240487A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2016240487A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2016240487A13</originalsourceid><addsrcrecordid>eNrjZBAJdvX1dPb3cwl1DvEPUnBxDfN0duVhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGhmZGJgYmFuaOhsbEqQIA_Twfog</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SEMICONDUCTOR DEVICE</title><source>esp@cenet</source><creator>Sakata Kazuyuki ; Hiranuma Kazuhiko</creator><creatorcontrib>Sakata Kazuyuki ; Hiranuma Kazuhiko</creatorcontrib><description>Signal transmission characteristics of a semiconductor device are improved. A plurality of wirings of a wiring substrate on which a semiconductor chip is mounted include a first wiring and a second wiring that constitute a differential pair for use in transmitting a differential signal. Moreover, the first wiring and the second wiring respectively have first portions that extend in parallel with each other with a first clearance and second portions that are formed on the same wiring layer as the first portions, and extend in parallel with each other with a second clearance and third portions that are installed between the first portions and the second portions and designed to detour in such directions as to allow the mutual clearance to become greater than the first clearance and the second clearance.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160818&DB=EPODOC&CC=US&NR=2016240487A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160818&DB=EPODOC&CC=US&NR=2016240487A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Sakata Kazuyuki</creatorcontrib><creatorcontrib>Hiranuma Kazuhiko</creatorcontrib><title>SEMICONDUCTOR DEVICE</title><description>Signal transmission characteristics of a semiconductor device are improved. A plurality of wirings of a wiring substrate on which a semiconductor chip is mounted include a first wiring and a second wiring that constitute a differential pair for use in transmitting a differential signal. Moreover, the first wiring and the second wiring respectively have first portions that extend in parallel with each other with a first clearance and second portions that are formed on the same wiring layer as the first portions, and extend in parallel with each other with a second clearance and third portions that are installed between the first portions and the second portions and designed to detour in such directions as to allow the mutual clearance to become greater than the first clearance and the second clearance.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBAJdvX1dPb3cwl1DvEPUnBxDfN0duVhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGhmZGJgYmFuaOhsbEqQIA_Twfog</recordid><startdate>20160818</startdate><enddate>20160818</enddate><creator>Sakata Kazuyuki</creator><creator>Hiranuma Kazuhiko</creator><scope>EVB</scope></search><sort><creationdate>20160818</creationdate><title>SEMICONDUCTOR DEVICE</title><author>Sakata Kazuyuki ; Hiranuma Kazuhiko</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2016240487A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2016</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Sakata Kazuyuki</creatorcontrib><creatorcontrib>Hiranuma Kazuhiko</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Sakata Kazuyuki</au><au>Hiranuma Kazuhiko</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SEMICONDUCTOR DEVICE</title><date>2016-08-18</date><risdate>2016</risdate><abstract>Signal transmission characteristics of a semiconductor device are improved. A plurality of wirings of a wiring substrate on which a semiconductor chip is mounted include a first wiring and a second wiring that constitute a differential pair for use in transmitting a differential signal. Moreover, the first wiring and the second wiring respectively have first portions that extend in parallel with each other with a first clearance and second portions that are formed on the same wiring layer as the first portions, and extend in parallel with each other with a second clearance and third portions that are installed between the first portions and the second portions and designed to detour in such directions as to allow the mutual clearance to become greater than the first clearance and the second clearance.</abstract><oa>free_for_read</oa></addata></record>
fulltext	fulltext_linktorsrc
identifier
ispartof
issn
language	eng
recordid	cdi_epo_espacenet_US2016240487A1
source	esp@cenet
subjects	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
title	SEMICONDUCTOR DEVICE
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-29T11%3A57%3A01IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Sakata%20Kazuyuki&rft.date=2016-08-18&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2016240487A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true