ELECTROSTATIC CHUCK DEVICE
Provided is an electrostatic chuck device in which breakdown between an electrostatic chuck portion and a cooling base portion can be prevented, voltage endurance can be improved, uniformity in the in-plane temperature of a mounting surface of the electrostatic chuck portion where a plate-shaped sam...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | TAKAHASHI Kentaro OOTOMO Megumi |
| description | Provided is an electrostatic chuck device in which breakdown between an electrostatic chuck portion and a cooling base portion can be prevented, voltage endurance can be improved, uniformity in the in-plane temperature of a mounting surface of the electrostatic chuck portion where a plate-shaped sample is mounted can be improved, and voltage endurance of a heating member can be improved by applying a uniform voltage between the electrostatic chuck portion and the cooling base portion. An electrostatic chuck device (10) includes: an electrostatic chuck portion (11) that includes a ceramic plate-shaped body and an internal electrode 18 for electrostatic adsorption; and a cooling base portion (12) that adjusts a temperature of the internal electrode (18) for electrostatic adsorption, in which a first insulating member (20) is adhered to a second main surface of the ceramic plate-shaped body through a first adhesive (19) so as to cover a periphery of the internal electrode for electrostatic adsorption (18), a second insulating member (14) is adhered to a top surface of the cooling base portion (12) through a second adhesive (13), a heating member (15) is provided on a top surface of the second insulating member (14), and the electrostatic chuck portion (11) and the cooling base portion (12) are adhered to each other and integrated through an organic adhesive layer (16). |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2016240422A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2016240422A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2016240422A13</originalsourceid><addsrcrecordid>eNrjZJBy9XF1DgnyDw5xDPF0VnD2CHX2VnBxDfN0duVhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGhmZGJgYmRkaOhsbEqQIAsSkhFw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>ELECTROSTATIC CHUCK DEVICE</title><source>esp@cenet</source><creator>TAKAHASHI Kentaro ; OOTOMO Megumi</creator><creatorcontrib>TAKAHASHI Kentaro ; OOTOMO Megumi</creatorcontrib><description>Provided is an electrostatic chuck device in which breakdown between an electrostatic chuck portion and a cooling base portion can be prevented, voltage endurance can be improved, uniformity in the in-plane temperature of a mounting surface of the electrostatic chuck portion where a plate-shaped sample is mounted can be improved, and voltage endurance of a heating member can be improved by applying a uniform voltage between the electrostatic chuck portion and the cooling base portion. An electrostatic chuck device (10) includes: an electrostatic chuck portion (11) that includes a ceramic plate-shaped body and an internal electrode 18 for electrostatic adsorption; and a cooling base portion (12) that adjusts a temperature of the internal electrode (18) for electrostatic adsorption, in which a first insulating member (20) is adhered to a second main surface of the ceramic plate-shaped body through a first adhesive (19) so as to cover a periphery of the internal electrode for electrostatic adsorption (18), a second insulating member (14) is adhered to a top surface of the cooling base portion (12) through a second adhesive (13), a heating member (15) is provided on a top surface of the second insulating member (14), and the electrostatic chuck portion (11) and the cooling base portion (12) are adhered to each other and integrated through an organic adhesive layer (16).</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ; ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERATION ; SEMICONDUCTOR DEVICES</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160818&DB=EPODOC&CC=US&NR=2016240422A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160818&DB=EPODOC&CC=US&NR=2016240422A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TAKAHASHI Kentaro</creatorcontrib><creatorcontrib>OOTOMO Megumi</creatorcontrib><title>ELECTROSTATIC CHUCK DEVICE</title><description>Provided is an electrostatic chuck device in which breakdown between an electrostatic chuck portion and a cooling base portion can be prevented, voltage endurance can be improved, uniformity in the in-plane temperature of a mounting surface of the electrostatic chuck portion where a plate-shaped sample is mounted can be improved, and voltage endurance of a heating member can be improved by applying a uniform voltage between the electrostatic chuck portion and the cooling base portion. An electrostatic chuck device (10) includes: an electrostatic chuck portion (11) that includes a ceramic plate-shaped body and an internal electrode 18 for electrostatic adsorption; and a cooling base portion (12) that adjusts a temperature of the internal electrode (18) for electrostatic adsorption, in which a first insulating member (20) is adhered to a second main surface of the ceramic plate-shaped body through a first adhesive (19) so as to cover a periphery of the internal electrode for electrostatic adsorption (18), a second insulating member (14) is adhered to a top surface of the cooling base portion (12) through a second adhesive (13), a heating member (15) is provided on a top surface of the second insulating member (14), and the electrostatic chuck portion (11) and the cooling base portion (12) are adhered to each other and integrated through an organic adhesive layer (16).</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CONVERSION OR DISTRIBUTION OF ELECTRIC POWER</subject><subject>ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GENERATION</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJBy9XF1DgnyDw5xDPF0VnD2CHX2VnBxDfN0duVhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGhmZGJgYmRkaOhsbEqQIAsSkhFw</recordid><startdate>20160818</startdate><enddate>20160818</enddate><creator>TAKAHASHI Kentaro</creator><creator>OOTOMO Megumi</creator><scope>EVB</scope></search><sort><creationdate>20160818</creationdate><title>ELECTROSTATIC CHUCK DEVICE</title><author>TAKAHASHI Kentaro ; OOTOMO Megumi</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2016240422A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2016</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CONVERSION OR DISTRIBUTION OF ELECTRIC POWER</topic><topic>ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GENERATION</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>TAKAHASHI Kentaro</creatorcontrib><creatorcontrib>OOTOMO Megumi</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TAKAHASHI Kentaro</au><au>OOTOMO Megumi</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ELECTROSTATIC CHUCK DEVICE</title><date>2016-08-18</date><risdate>2016</risdate><abstract>Provided is an electrostatic chuck device in which breakdown between an electrostatic chuck portion and a cooling base portion can be prevented, voltage endurance can be improved, uniformity in the in-plane temperature of a mounting surface of the electrostatic chuck portion where a plate-shaped sample is mounted can be improved, and voltage endurance of a heating member can be improved by applying a uniform voltage between the electrostatic chuck portion and the cooling base portion. An electrostatic chuck device (10) includes: an electrostatic chuck portion (11) that includes a ceramic plate-shaped body and an internal electrode 18 for electrostatic adsorption; and a cooling base portion (12) that adjusts a temperature of the internal electrode (18) for electrostatic adsorption, in which a first insulating member (20) is adhered to a second main surface of the ceramic plate-shaped body through a first adhesive (19) so as to cover a periphery of the internal electrode for electrostatic adsorption (18), a second insulating member (14) is adhered to a top surface of the cooling base portion (12) through a second adhesive (13), a heating member (15) is provided on a top surface of the second insulating member (14), and the electrostatic chuck portion (11) and the cooling base portion (12) are adhered to each other and integrated through an organic adhesive layer (16).</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_US2016240422A1 |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERATION SEMICONDUCTOR DEVICES |
| title | ELECTROSTATIC CHUCK DEVICE |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-22T08%3A50%3A56IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=TAKAHASHI%20Kentaro&rft.date=2016-08-18&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2016240422A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |