Enclosures And Methods Of Managing Heat In Heat Generating Modules

An example enclosure includes a top portion, a bottom portion, and at least one heat generating module adjacent the top portion of the enclosure. The heat generating module includes an inlet side, an outlet side, a heat generating component and an internal fan. The enclosure also includes a heat col...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	BIRAGONI Arunkumar, KHANDELWAL Adarsh
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!