IMAGE SENSOR PACKAGE AND AN IMAGE SENSOR MODULE HAVING THE SAME

IMAGE SENSOR PACKAGE AND AN IMAGE SENSOR MODULE HAVING THE SAME

Disclosed are an image sensor package and an image sensor module having the same. A diffusion resistor is provided on a circuit board for preventing liquid drop diffusion when the liquid drop is compressed. An image sensor chip is mounted on the circuit board such that a central portion of the image...

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1. Verfasser: PARK OK-GYEONG
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator PARK OK-GYEONG
description Disclosed are an image sensor package and an image sensor module having the same. A diffusion resistor is provided on a circuit board for preventing liquid drop diffusion when the liquid drop is compressed. An image sensor chip is mounted on the circuit board such that a central portion of the image sensor chip is positioned on the diffusion resistor of the circuit board. A bonding member is interposed between the circuit board and the image sensor chip around the diffusion resistor such that a bonding area of the image sensor chip is smaller than a surface area of a bonding face of the image sensor chip. Warpage characteristics of the image sensor package are improved by the diffusion resistor.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title IMAGE SENSOR PACKAGE AND AN IMAGE SENSOR MODULE HAVING THE SAME
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