WAFER HOLDER AND METHOD FOR MANUFACTURING THE SAME
A wafer holder 10 includes a resin adhesive layer 16 between a ceramic electrostatic chuck 12 and a metal cooling plate 14. The adhesive layer 16 includes a first layer 16a in contact with the electrostatic chuck 12, a second layer 16b in contact with the cooling plate 14, and an intermediate layer...
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| creator | TSURUTA HIDEYOSHI OHBA KAZUMA KAWAJIRI TETSUYA YANOH TAKUYA |
| description | A wafer holder 10 includes a resin adhesive layer 16 between a ceramic electrostatic chuck 12 and a metal cooling plate 14. The adhesive layer 16 includes a first layer 16a in contact with the electrostatic chuck 12, a second layer 16b in contact with the cooling plate 14, and an intermediate layer 16c located between the first layer 16a and the second layer 16b. Heat resistance of each of the first layer 16a and the intermediate layer 16c is higher than heat resistance of the second layer 16b, flexibility of the second layer 16b is higher than flexibility of each of the first layer 16a and the intermediate layer 16c, and the layers are in hermetic contact with each other. |
| format | Patent |
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The adhesive layer 16 includes a first layer 16a in contact with the electrostatic chuck 12, a second layer 16b in contact with the cooling plate 14, and an intermediate layer 16c located between the first layer 16a and the second layer 16b. Heat resistance of each of the first layer 16a and the intermediate layer 16c is higher than heat resistance of the second layer 16b, flexibility of the second layer 16b is higher than flexibility of each of the first layer 16a and the intermediate layer 16c, and the layers are in hermetic contact with each other.</description><language>eng</language><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING ; ARTIFICIAL STONE ; BASIC ELECTRIC ELEMENTS ; CEMENTS ; CERAMICS ; CHEMISTRY ; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS ; CONCRETE ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES ; INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS ; LIME, MAGNESIA ; METALLURGY ; PERFORMING OPERATIONS ; REFRACTORIES ; SEMICONDUCTOR DEVICES ; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR ; SHAPING OR JOINING OF PLASTICS ; SLAG ; TRANSPORTING ; TREATMENT OF NATURAL STONE ; WORKING OF PLASTICS ; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160707&DB=EPODOC&CC=US&NR=2016196999A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25568,76551</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160707&DB=EPODOC&CC=US&NR=2016196999A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TSURUTA HIDEYOSHI</creatorcontrib><creatorcontrib>OHBA KAZUMA</creatorcontrib><creatorcontrib>KAWAJIRI TETSUYA</creatorcontrib><creatorcontrib>YANOH TAKUYA</creatorcontrib><title>WAFER HOLDER AND METHOD FOR MANUFACTURING THE SAME</title><description>A wafer holder 10 includes a resin adhesive layer 16 between a ceramic electrostatic chuck 12 and a metal cooling plate 14. The adhesive layer 16 includes a first layer 16a in contact with the electrostatic chuck 12, a second layer 16b in contact with the cooling plate 14, and an intermediate layer 16c located between the first layer 16a and the second layer 16b. Heat resistance of each of the first layer 16a and the intermediate layer 16c is higher than heat resistance of the second layer 16b, flexibility of the second layer 16b is higher than flexibility of each of the first layer 16a and the intermediate layer 16c, and the layers are in hermetic contact with each other.</description><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</subject><subject>ARTIFICIAL STONE</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CEMENTS</subject><subject>CERAMICS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS</subject><subject>CONCRETE</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES</subject><subject>INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS</subject><subject>LIME, MAGNESIA</subject><subject>METALLURGY</subject><subject>PERFORMING OPERATIONS</subject><subject>REFRACTORIES</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</subject><subject>SHAPING OR JOINING OF PLASTICS</subject><subject>SLAG</subject><subject>TRANSPORTING</subject><subject>TREATMENT OF NATURAL STONE</subject><subject>WORKING OF PLASTICS</subject><subject>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDAKd3RzDVLw8PdxAVKOfi4Kvq4hHv4uCm7-QQq-jn6hbo7OIaFBnn7uCiEergrBjr6uPAysaYk5xam8UJqbQdnNNcTZQze1ID8-tbggMTk1L7UkPjTYyMDQzNDSzNLS0tHQmDhVAPRAJ54</recordid><startdate>20160707</startdate><enddate>20160707</enddate><creator>TSURUTA HIDEYOSHI</creator><creator>OHBA KAZUMA</creator><creator>KAWAJIRI TETSUYA</creator><creator>YANOH TAKUYA</creator><scope>EVB</scope></search><sort><creationdate>20160707</creationdate><title>WAFER HOLDER AND METHOD FOR MANUFACTURING THE SAME</title><author>TSURUTA HIDEYOSHI ; OHBA KAZUMA ; KAWAJIRI TETSUYA ; YANOH TAKUYA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2016196999A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2016</creationdate><topic>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</topic><topic>ARTIFICIAL STONE</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CEMENTS</topic><topic>CERAMICS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS</topic><topic>CONCRETE</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES</topic><topic>INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS</topic><topic>LIME, MAGNESIA</topic><topic>METALLURGY</topic><topic>PERFORMING OPERATIONS</topic><topic>REFRACTORIES</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</topic><topic>SHAPING OR JOINING OF PLASTICS</topic><topic>SLAG</topic><topic>TRANSPORTING</topic><topic>TREATMENT OF NATURAL STONE</topic><topic>WORKING OF PLASTICS</topic><topic>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</topic><toplevel>online_resources</toplevel><creatorcontrib>TSURUTA HIDEYOSHI</creatorcontrib><creatorcontrib>OHBA KAZUMA</creatorcontrib><creatorcontrib>KAWAJIRI TETSUYA</creatorcontrib><creatorcontrib>YANOH TAKUYA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TSURUTA HIDEYOSHI</au><au>OHBA KAZUMA</au><au>KAWAJIRI TETSUYA</au><au>YANOH TAKUYA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>WAFER HOLDER AND METHOD FOR MANUFACTURING THE SAME</title><date>2016-07-07</date><risdate>2016</risdate><abstract>A wafer holder 10 includes a resin adhesive layer 16 between a ceramic electrostatic chuck 12 and a metal cooling plate 14. The adhesive layer 16 includes a first layer 16a in contact with the electrostatic chuck 12, a second layer 16b in contact with the cooling plate 14, and an intermediate layer 16c located between the first layer 16a and the second layer 16b. Heat resistance of each of the first layer 16a and the intermediate layer 16c is higher than heat resistance of the second layer 16b, flexibility of the second layer 16b is higher than flexibility of each of the first layer 16a and the intermediate layer 16c, and the layers are in hermetic contact with each other.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING ARTIFICIAL STONE BASIC ELECTRIC ELEMENTS CEMENTS CERAMICS CHEMISTRY COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS CONCRETE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS LIME, MAGNESIA METALLURGY PERFORMING OPERATIONS REFRACTORIES SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS SLAG TRANSPORTING TREATMENT OF NATURAL STONE WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL |
| title | WAFER HOLDER AND METHOD FOR MANUFACTURING THE SAME |
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