METHODS AND SYSTEMS FOR SOLID STATE HEAT TRANSFER
Various embodiments are directed to a thermoelectric device comprising a thermoelectric element, a first heat switch and a second heat switch. The thermoelectric element may comprise a first component in electrical contact with a second component at an interface. The first component may comprise a f...
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| creator | YUAN SIDNEY W. K LAM TUNG T |
| description | Various embodiments are directed to a thermoelectric device comprising a thermoelectric element, a first heat switch and a second heat switch. The thermoelectric element may comprise a first component in electrical contact with a second component at an interface. The first component may comprise a first material and the second component may comprise a second material different from the first material. The first heat switch may comprise a first terminal in thermal contact with the interface and a second terminal in thermal contact with a thermal reservoir. The second heat switch may comprise a first terminal in thermal contact with the interface and a second terminal in thermal contact with a thermal load. |
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The thermoelectric element may comprise a first component in electrical contact with a second component at an interface. The first component may comprise a first material and the second component may comprise a second material different from the first material. The first heat switch may comprise a first terminal in thermal contact with the interface and a second terminal in thermal contact with a thermal reservoir. The second heat switch may comprise a first terminal in thermal contact with the interface and a second terminal in thermal contact with a thermal load.</description><language>eng</language><subject>BLASTING ; COMBINED HEATING AND REFRIGERATION SYSTEMS ; ELECTRICITY ; HEAT PUMP SYSTEMS ; HEATING ; LIGHTING ; LIQUEFACTION SOLIDIFICATION OF GASES ; MANUFACTURE OR STORAGE OF ICE ; MECHANICAL ENGINEERING ; REFRIGERATION MACHINES, PLANTS OR SYSTEMS ; REFRIGERATION OR COOLING ; WEAPONS</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160616&DB=EPODOC&CC=US&NR=2016169564A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160616&DB=EPODOC&CC=US&NR=2016169564A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YUAN SIDNEY W. 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The second heat switch may comprise a first terminal in thermal contact with the interface and a second terminal in thermal contact with a thermal load.</description><subject>BLASTING</subject><subject>COMBINED HEATING AND REFRIGERATION SYSTEMS</subject><subject>ELECTRICITY</subject><subject>HEAT PUMP SYSTEMS</subject><subject>HEATING</subject><subject>LIGHTING</subject><subject>LIQUEFACTION SOLIDIFICATION OF GASES</subject><subject>MANUFACTURE OR STORAGE OF ICE</subject><subject>MECHANICAL ENGINEERING</subject><subject>REFRIGERATION MACHINES, PLANTS OR SYSTEMS</subject><subject>REFRIGERATION OR COOLING</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDD0dQ3x8HcJVnD0c1EIjgwOcfUNVnDzD1II9vfxBIqEOIa4Kni4OoYohAQ5-gW7uQbxMLCmJeYUp_JCaW4GZTfXEGcP3dSC_PjU4oLE5NS81JL40GAjA0MzQzNLUzMTR0Nj4lQBAOvTJ4U</recordid><startdate>20160616</startdate><enddate>20160616</enddate><creator>YUAN SIDNEY W. 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K</creatorcontrib><creatorcontrib>LAM TUNG T</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YUAN SIDNEY W. K</au><au>LAM TUNG T</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHODS AND SYSTEMS FOR SOLID STATE HEAT TRANSFER</title><date>2016-06-16</date><risdate>2016</risdate><abstract>Various embodiments are directed to a thermoelectric device comprising a thermoelectric element, a first heat switch and a second heat switch. The thermoelectric element may comprise a first component in electrical contact with a second component at an interface. The first component may comprise a first material and the second component may comprise a second material different from the first material. The first heat switch may comprise a first terminal in thermal contact with the interface and a second terminal in thermal contact with a thermal reservoir. The second heat switch may comprise a first terminal in thermal contact with the interface and a second terminal in thermal contact with a thermal load.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BLASTING COMBINED HEATING AND REFRIGERATION SYSTEMS ELECTRICITY HEAT PUMP SYSTEMS HEATING LIGHTING LIQUEFACTION SOLIDIFICATION OF GASES MANUFACTURE OR STORAGE OF ICE MECHANICAL ENGINEERING REFRIGERATION MACHINES, PLANTS OR SYSTEMS REFRIGERATION OR COOLING WEAPONS |
| title | METHODS AND SYSTEMS FOR SOLID STATE HEAT TRANSFER |
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