FABRICATION METHOD OF SEMICONDUCTOR PACKAGE HAVING EMBEDDED SEMICONDUCTOR ELEMENTS

A semiconductor package is disclosed, which includes: a carrier having at least an opening; a plurality of conductive traces formed on the carrier and in the opening; a first semiconductor element disposed in the opening and electrically connected to the conductive traces; a second semiconductor ele...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHEN YAN-HENG, LIU HUNG-WEN, LIN CHUN-TANG, HSU HSIANG, LIAO YAN-YI, CHI CHIEH-YUAN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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