MOLD PACKAGE AND MANUFACTURING METHOD THEREOF

A mold package includes a substrate having a first surface and a second surface disposed opposite to the first surface, a wiring part disposed on the first surface in protruded manner, a molding resin, and a resin film. The molding resin partially seals the first surface of the substrate and the wir...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	OKA KENGO, UCHIBORI SHINYA, TAKENAKA MASAYUKI, SANADA YUKI, FUKUDA TASUKE
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!