LEADLESS SEMICONDUCTOR DEVICE AND METHOD OF MAKING THEREOF

LEADLESS SEMICONDUCTOR DEVICE AND METHOD OF MAKING THEREOF

Consistent with an example embodiment, there is a leadless packaged semiconductor device having top and bottom opposing major surfaces and sidewalls extending there between. The leadless packaged semiconductor device comprises a lead frame sub-assembly having an array of two or more lead frame porti...

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Hauptverfasser: FUNG YEE WAI, LEUNG CHI HO, HO WAIKEUNG
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator FUNG YEE WAI
LEUNG CHI HO
HO WAIKEUNG
description Consistent with an example embodiment, there is a leadless packaged semiconductor device having top and bottom opposing major surfaces and sidewalls extending there between. The leadless packaged semiconductor device comprises a lead frame sub-assembly having an array of two or more lead frame portions each having a semiconductor die arranged thereon. At least five I/O terminals each of said terminals comprise a respective metal side pad; and the respective metal side pad has a step profile. A feature of this embodiment is that these metal side pads, having a step profile, are electroplated to enhance their solderability.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title LEADLESS SEMICONDUCTOR DEVICE AND METHOD OF MAKING THEREOF
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