SYSTEM FOR COOLING DUAL SIDES OF POWER SEMICONDUCTOR DEVICE

A system for cooling dual sides of power semiconductor devices includes two (2) cooling water flow passages, each of which being bent in the "" or "S" shape, to allow a plurality of power semiconductor devices to be inserted in the cooling water flow passage and to allow each pow...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	JEONG EUI-SOO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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