FABRICATION METHOD OF EMBEDDED CHIP SUBSTRATE

An embedded chip substrate includes a first insulation layer, a core layer, a chip, a second insulation layer, a first circuit layer, and a second circuit layer. The core layer disposed on the first insulation layer has an opening that exposes a portion of the first insulation layer. The chip is adh...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: WANG YUNG-HUI, OU YING-TE
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!