METHOD FOR DEPOSITING FILMS ON SEMICONDUCTOR WAFERS

An exemplary embodiment of the present invention provides a method of depositing of a film on semiconductor wafers. In a first step, a film thickness of 3 um or less is deposited on wafers accommodated in a wafer boat in a vertical furnace at a deposition temperature of the furnace while a depositio...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HUUSSEN FRANK, VAN AERDE STEVEN R.A, DINGEMANS GIJS
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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