PACKAGE ARRANGEMENT, A PACKAGE, AND A METHOD OF MANUFACTURING A PACKAGE ARRANGEMENT

According to various embodiments, a package arrangement may include: a first encapsulation material; at least one electronic circuit at least partially embedded in the first encapsulation material, the at least one electronic circuit including a first contact pad structure at a first side of the at...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WACHTER ULRICH, KILGER THOMAS
Format:	Patent
Sprache:	eng
Schlagworte:	MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS TRANSPORTING
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